17
Preliminary
GM5BW97331A
?SPAN class="pst GM5BW97331A_2663707_3">Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 20 shows the recommended solder pad design for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
?SPAN class="pst GM5BW97331A_2663707_3">Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
"Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Fig. 20 Recommended Solder Pad Design
1.5
OTE: Unit: mm
1.5
4.5
-
Center of Product
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